MediaTek claims big upgrades for the Dimensity 8400-Ultra over its predecessor, but are those enough to put it ahead of the Snapdragon 8s Gen 3? Let’s compare them to see how the two chips stack up against each other.
Both the Dimensity 8400-Ultra and Snapdragon 8s Gen 3 are manufactured by TSMC using its 4nm process node. However, the CPU architectures have notable differences.
The Dimensity 8400-Ultra has all Cortex-A725 cores. One of them runs at 3.25GHz, three of them run at 3GHz, and the remaining four at 2.1GHz. The SD 8s Gen 3’s CPU architecture consists of one Cortex-X4 core clocked at 3GHz, four Cortex-A720 cores at 2.8GHz, and three Cortex-A520 cores at 2GHz.
The remaining seven cores in the Dimensity chip are more powerful and power-efficient and run at higher clock speeds than those in the SD 8s Gen 3.
Both chips have high-performance GPUs to satisfy the users’ gaming needs. The Dimensity 8400-Ultra has a Mali-G720 MP7 GPU, whereas the Snapdragon 8s Gen 3 has an Adreno 735 GPU.
The two chips can handle on-device AI tasks, thanks to a hexagon NPU in the 8s Gen 3 and MediaTek NPU 980 inside the Dimensity 8400
Both support LPDDR5X and UFS 4.0 and support all connectivity features, although there are some differences. For example, the Dimensity 8400-Ultra chip supports Wi-Fi 6, but the Snapdragon 8s Gen 3 supports a newer Wi-Fi 7 standard. However, it’s the opposite for Bluetooth; v5.4 on the 8s Gen 3 and v6 on Dimensity 8400-Ultra.
The Dimensity 8400-Ultra outperforms the Snapdragon 8s Gen 3 chip on the AnTuTu benchmark. The former scored 1.79 million AnTuTu points, while the latter scored only 1.65 million AnTuTu points.
The Dimensity 8400-Ultra lags behind the Snapdragon 8s Gen 3 in single-core performance but surprisingly performs better in multi-core performance.
The Dimensity 8400-Ultra also leads the 3D Mark Wild Life Extreme test. It received 4,086 points, whereas the Snapdragon 8s Gen 3 could only manage to pull off 3,161 points.
Source - Gizmochina
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