Today, MediaTek officially unveiled the Dimensity 8450 SoC at their India Dimensity Summit on June 20–21, 2025—positioning it as a “pseudo-flagship” 5G chip for premium mid-range phones. 

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CPU & Performance

Built on TSMC's 2nd‑gen 4 nm node, it features an All‑Big‑Core octa‑core CPU: 8× Cortex‑A725 (1×1 MB L2, 3×512 KB, 4×256 KB) with 6 MB L3 + 5 MB SLC cache—offering up to 30% improved performance & efficiency vs rivals.  

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GPU & Gaming

The Mali‑G720 MC7 GPU (7 cores) is optimized with HyperEngine MAGT 3.0 and StarSpeed Engine, boosting gaming response and power efficiency while smoothing network handover from 5G to Wi‑Fi.  

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AI Power

AI is powered by the NPU 880 with the Agentic AI Engine for advanced generative AI and on‑device LLM tasks—claimed to be the strongest in its class.  

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Camera & Video

Features a dual‑EIS engine and Imagiq 1080 ISP, enabling 4K60 HDR (HLG) recording, zero‑lag HDR stills, and support for up to 320 MP sensors with in‑sensor zoom and full PDAF. Plus, a Live Broadcast Booster improves livestream face clarity with 7% less power.  

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Connectivity & Memory

— 5G‑A modem with 3CC carrier aggregation, peak speeds ~5.17 Gbps

— Wi‑Fi 6E (2T2R), Bluetooth 5.4

— Supports WQHD+ at 144 Hz & dual‑screen setups

— LPDDR5X RAM (up to 8533 Mbps), UFS 4.0 storage with MCQ

Also includes UltraSave 3.0+ for 5G power efficiency.  

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Launch & Phones

OPPO’s upcoming Reno 14 Pro in India will be the first to sport the Dimensity 8450, followed by a K‑series phone soon.

@iQOO Connect